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product structure : silicon integrated circuit this product has no designed protection against radioactive rays 1/ 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 tsz22111 ? 14 ? 001 www.rohm.com gate driver providing galvanic isolation series isolation voltage 2500vrms 1ch gate driver providing galvanic isolation b m60014fv - c general description the bm60014fv - c is a gate driver with an isolation voltage of 2500vrms, i/o delay time of 120ns, and minimum input pulse width of 70ns . it incorporates the fault signal output functions, u nder - voltage l ockout (uvlo) function and miller clamp function . features ? aec - q100 qualified ( n ote1) ? providing galvanic isolation ? active miller clamping ? fault signal output function ? under - voltage l ockout function ? ul 1577 recognized :file no. e356010 (note1: grade1) applications ? igbt gate driver ? mosfet gate driver key specification s ? isolation voltage: 2500vrms ? maximum gate drive voltage: 24v ? i /o delay time : 120ns ( max ) ? minimum input pulse width: 70ns (max) package w(typ) x d(typ) x h(max) ssop - b20w 6.50 mm x 8.10 mm x 2.01 mm typical application circuit s 1pin gnd1 gen nc nc p vcc1 ina u inb u xflt u nc u nc u gnd1 u nc gen gnd2 nc p vcc 2 out u mc u nc u nc u gnd2 nc u uvlo1 1 uvlo1 pulse generator uvlo2 s q r pre - driver + - figure 1 . application c ircuits (igbt gate driver ) 1pin gnd1 gen nc nc p vcc1 ina u inb u xflt u nc u nc u gnd1 u nc gen gnd2 nc p vcc 2 out u mc u nc u nc u gnd2 nc u uvlo1 1 uvlo1 pulse generator uvlo2 s q r pre - driver + - figure 2 . application c ircuits (mosfet gate driver ) datashee t
2 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c recommended r ange of e xternal c onstants pin name symbol recommended value unit min. typ. max. vcc1 c vcc1 0.1 1.0 - f vcc2 c vcc2 0.33 - - f pin con f iguration s pin descriptio ns pin no. pin name function 1 nc no connect ion 2 gnd2 output - side ground pin 3 nc no connect ion 4 nc no connect ion 5 m c output pin for miller clamp 6 out output pin 7 vcc2 output - side power supply pin 8 nc no connect ion 9 gnd2 output - side ground pin 10 nc no connect ion 11 gnd1 input - side ground pin 12 nc no connect ion 13 nc no connect ion 14 vcc1 input - side power supply pin 15 ina control input pin a 16 inb control input pin b 17 xflt fault signal output pin 18 nc no connect ion 19 nc no connect ion 20 gnd1 input - side ground pin 8 8 gnd1 nc 20 1 8 nc gnd2 19 2 8 nc 1 8 3 8 xflt nc 17 4 8 inb mc 16 5 8 ina out 15 6 8 vcc1 vcc2 14 7 nc nc 8 8 nc gnd2 12 9 8 gnd1 nc 11 1 0 13 nc (top view)
3 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c description of pins and cautions on layout of board 1) vcc1 (input - side power supply pin) the vcc1 pin is a power supply pin on the input side. to suppress voltage fluctuations due to the current to drive internal transformers, connect a bypass capacitor between the vcc1 and the gnd1 pins. 2) gnd1 (input - side ground pin) the gnd1 pin is a ground pin on the input side. 3) vcc2 (output - side positive power supply pin) the vcc2 pin is a power supply pin on the output side. to reduce voltage fluctuations due to out pin output current, connect a bypass capacitor between the vcc2 and the gnd2 pins. 4) gnd2 (output - side ground pin) the gnd2 pin is a ground pin on the output side. 5) in a , inb (control input terminal) the in a and inb pins are used to determine output logic. inb ina out h l l h h l l l l l h h 6) out (output pin) the out pin is used to drive the gate of a power device. 7) mc (output pin for miller clamp) the mc pin is for preventing the increase in gate voltage due to the miller current of the power device connected to the out pin. if the miller clamp function is not used, short - circuit the mc pi n to the gnd2 pin. 8) xflt (fault signal output pin) the x flt pin is an open drain pin used to output a fault signal when a fault occurs (i.e., when the u nder - voltage l ockout function (uvlo1) is activated) . conditions xflt while in normal operation l when an fault occurs (when uvlo1 is activated) hi - z
4 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c description of functions and examples of constant setting 1) miller clamp function when in a =l and out pin voltage < v mcon (typ 2v), the internal mosfet of the mc pin is turned on. in a mc i nternal mosfet of the mc pin l less than v mcon on h x off ina gate out t poff a t po na h l h l h l mc v mcon l hi - z figure 4. timing chart of miller clamp function vcc2 out + - mc logic gnd2 predriver predriver predriver fig ure 3. block diagram of miller clamp function. v mcon gate
5 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c 2 ) under - voltage lockout ( uvlo ) function the bm60014fv - c incorporates the u nder - voltage l ockout (uvlo) function both on the low and the high voltage sides. when the power supply voltage drops to the uvlo on voltage (low voltage side typ 3.4v, high voltage side voltage typ 9.5v) , the out pin will output the l signal. in addition, to prevent malfunctions due to noises, a mask time of t uvlo1msk ( typ 2.5 s ) and t uvlo2msk ( typ 2.85 s ) are set on both the low and the high voltage sides. this ic does not have a function which feeds back the high voltage side state to the low voltage side. a fter the high voltage side uvlo is release d , the input signal will take effect from the time after the input signal switches. figure 5. input - side uvlo function operation timing chart ina out vcc1 h l xflt h l hi - z l figure 6. output - side uvlo function operation timing chart ina out vcc2 h l xflt h l hi - z l v uvlo1h v uvlo 2 h v uvlo 2l hi - z
6 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c 3 i/o condition table no. status input output v c c 1 v c c 2 i n b i n a o u t m c x f l t 1 vcc1uvlo uvlo x x x l l h 2 vcc2uvlo x uvlo x x l l l 3 inb active : vcc1 or vcc2 > uvlo, x:don't care 4) power supply startup / shutoff sequence ina out vcc2 h l h l v uvlo 1 h v uvlo 2h hi - z vcc1 xflt l hi - z mc hi - z v uvlo 1 h v uvlo 1l v uvlo 1l l v uvlo 2l v uvlo 2l v uvlo 2h figure 7 . p ower s upply s tartup / s hutoff s equence : since the vcc2 to gnd2 pin voltage is low and the output mos does not turn on, the output pins become hi - z.
7 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c absolute maximum ratings (note 1) relative to gnd1. (note 2) relative to gnd2. (note 3) should not exceed pd and tj=150 c (note 4) d erate by 9.5mw/ c when operating above ta=25c . mounted on a glass epoxy of 70mm 70mm 1.6mm. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating ratings parameter symbol min. max. units input - side supply voltage v cc1 (note 5) 4.5 5.5 v cc1 (note 5) output - side supply voltage v cc2 (note 6) 10 24 v cc2 (note 6) (note 5) relative to gnd1. (note 6) relative to gnd2. insulation r elated c haracteristics parameter symbol characteristic units insulation resistance (v io =500v) r s >10 9 insulation withstand voltage / 1min v iso 2500 vrms insulation test voltage / 1sec v iso 3000 vrms parameter symbol limits unit input - side supply voltage v cc1 - 0.3 +7.0 (note 1) v output - side supply voltage v cc2 - 0.3 +30.0 (note 2) v ina pin input voltage v in a - 0.3 +vcc1+0.3 or +7.0 (note 3) v inb pin input voltage v in b - 0.3 +vcc1+0.3 or +7.0 (note1) v out pin output current (peak 10 s) i outpeak 5 .0 (note 3) a xflt pin output current i xflt 10 ma power dissipation p d 1.19 (note 4) w operating temperature range t opr - 40 +125 c storage temperature range t stg - 55 +150 c junction temperature t jmax +150 c
8 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c electrical characteristics unless otherwise specified t a = - 40 c to 125 c , v cc1 =4.5v to 5.5v, v cc2 =10v to 24v parameter symbol min. typ. max. unit conditions general input side circuit current 1 i cc11 0.06 0.14 0.22 ma input side circuit current 2 i cc12 0.10 0.20 0.30 ma in a =10khz, duty=50% input side circuit current 3 i cc13 0.15 0.30 0.45 ma in a =20khz, duty=50% output side circuit current 1 i cc21 0.26 0.44 0. 62 ma out=l output side circuit current 2 i cc22 0.22 0.38 0. 57 ma out=h logic block logic high level input voltage v inh 2.0 - v cc1 v in a, inb logic low level input voltage v inl 0 - 0.8 v in a, inb logic pull - down resistance r ind 25 50 100 k inm in - - 70 ns in a, inb output out on resistance (source) r onh 0.4 0.9 2.0 out = - 40ma out on resistance (sink) r onl 0.2 0.6 1.3 out =40ma out maximum current (source) i outmaxh 3.0 4.5 - a vcc2=15v, guaranteed by design out maximum current (sink) i outmaxl 3.0 3.9 - a vcc2=15v, guaranteed by design turn on time t pona 70 90 120 ns ina=pwm, inb=l t ponb 6 5 85 115 ns ina=h, inb=pwm turn off time t poffa 70 90 120 ns ina=pwm, inb=l t poffb 7 5 9 5 125 ns ina=h, inb=pwm propagation distortion t pdista - 25 0 25 ns t poffa C pona t pdistb - 15 10 35 ns t poffb C ponb rise time t rise - 50 - ns 10nf between out - gnd2 fall time t fall - 50 - ns 10nf between out - gnd2 mc on resistance r onmc 0.20 0.65 1.40 mc =40ma mc on threshold voltage v mcon 1.8 2 2.2 v common mode transient immunity cm 100 - - kv/ s guaranteed by design protection functions vcc1 uvlo off voltage v uvlo1h 3.35 3.50 3.65 v vcc1 uvlo on voltage v uvlo1l 3.25 3.40 3.55 v vcc1 uvlo mask time t uvlo1msk 1.0 2.5 5.0 s vcc2 uvlo off voltage v uvlo2h 9.0 9.5 10.0 v vcc2 uvlo on voltage v uvlo2l 8.0 8.5 9.0 v vcc2 uvlo mask time t uvlo2msk 1.00 2.85 5.00 s xflt output l voltage v xflt - 0.10 0.25 v i xflt =5ma ina out t rise t fall t pona t poffa 50% 50% 90% 50% 50% 90% 10% 10% figure 8. in - out timing chart
9 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c ul1577 ratings table following values are described in ul report. parameter values units conditions side 1 (input side) circuit current 0.14 ma vcc1=5.0v, out=l side 2 (output side) circuit current 0.44 ma vcc2=v, out=l side 1 (input side) consumption power 0.7 mw vcc1=5.0v, out=l side 2 (output side) consumption power 6.6 mw vcc2= 15 v, out=l isolation voltage 2500 vrms maximum operating (ambient) temperature 125
10 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c t ypical performance curves 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 0.22 4.50 4.75 5.00 5.25 5.50 icc11 [ma] vcc1 [v] 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 0.22 -40 -20 0 20 40 60 80 100 120 icc11 [ma] ta [ c] 0.10 0.14 0.18 0.22 0.26 0.30 4.50 4.75 5.00 5.25 5.50 icc12 [ma] vcc1 [v] 0.10 0.14 0.18 0.22 0.26 0.30 -40 -20 0 20 40 60 80 100 120 icc12 [ma] ta [ c] figure 9. input side circuit current vs input side supply voltage figure 10. input s ide c ircuit c urrent vs temperature ta= - 40 c ta=25 c ta=125 c vcc1=5.0v ta= - 40 c ta=25 c ta=125 c vcc1=4.5v vcc1=5.5v vcc1=5.0v vcc1=4.5v vcc1=5.5v figure 11. input s ide c ircuit c urrent vs input side supply voltage ( at in a =10khz, duty=50% ) figure 12. input s ide c ircuit c urrent vs temperature ( at in a =10khz, duty=50% )
11 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c t ypical performance curves - continued 2.1 2.5 2.9 3.3 3.7 4.1 4.5 4.9 4.50 4.75 5.00 5.25 5.50 icc14 [ma] vcc1 [v] 0.15 0.20 0.25 0.30 0.35 0.40 0.45 -40 -20 0 20 40 60 80 100 120 icc13 [ma] ta [ c] 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 10 12 14 16 18 20 22 24 icc21 [ma] vcc2 [v] 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 -40 -20 0 20 40 60 80 100 120 icc21 [ma] ta [ c] figure 15. output side c ircuit c urrent vs output side supply voltage ( at out=l) figure 16. output side circuit c urrent vs temperature ( at out=l) figure 13. input s ide c ircuit c urrent vs input side supply voltage (ina=20khz, duty=50%) figure 14. input s ide c ircuit c urrent vs temperature (ina=20khz, duty=50%) ta= - 40 c ta=25 c ta=125 c vcc1=5.0v vcc1=4.5v vcc1=5.5v ta= - 40 c ta=25 c ta=125 c vcc2=15v vcc2=10v vcc2=24v
12 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c t ypical performance curves - continued figure 17. output side circuit current vs output side supply voltage ( at out=h ) figure 18. output side circuit current vs temperature ( at out=h ) 0.22 0.27 0.32 0.37 0.42 0.47 0.52 0.57 10 12 14 16 18 20 22 24 icc22 [ma] vcc2 [v] 0.22 0.27 0.32 0.37 0.42 0.47 0.52 0.57 -40 -20 0 20 40 60 80 100 120 icc22 [ma] ta [ c] figure 19. logic (ina/inb) high/low level voltage vs input side supply voltage figure 20. out vs logic (ina) input voltage (vcc1=5v, vcc2=15v, ta=25 c ) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 4.50 4.75 5.00 5.25 5.50 vinh / vinl [v] vcc1 [v] 0 4 8 12 16 20 24 0 1 2 3 4 5 out [v] ina [v] vcc1=5v ta= - 40 c ta=25 c ta=125 c vcc2=15v vcc2=10v vcc2=24v ta= - 40 c ta=25 c ta=125 c ta= - 40 c ta=25 c ta=125 c h level l level
13 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c t ypical performance curves - continued figure 21. logic p ull - down r esistance vs temperature fig ure 2 2 . logic (ina) i nput m i nimum p ulse w idth vs temperature 0 25 50 75 100 -40 -20 0 20 40 60 80 100 120 rind [k ] 0.4 0.8 1.2 1.6 2.0 -40 -20 0 20 40 60 80 100 120 ronh [ ] 0.2 0.4 0.6 0.8 1.0 1.2 -40 -20 0 20 40 60 80 100 120 ronl [ ]
14 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c t ypical performance curves - continued figure 25. turn on time vs temperature (ina=pwm, inb=l) figure 26. turn off time vs temperature (ina=pwm, inb=l) 70 80 90 100 110 120 -40 -20 0 20 40 60 80 100 120 tpona [ns] ta [ c] 70 80 90 100 110 120 -40 -20 0 20 40 60 80 100 120 tpoffa [ns] ta [ c] vcc2=10v vcc2=15v vcc2=24v vcc2=10v vcc2=15v vcc2=24v figure 27. turn on time vs temperature (ina=h, inb=pwm) figure 28. turn off time vs temperature (ina=h, inb=pwm) 70 80 90 100 110 120 -40 -20 0 20 40 60 80 100 120 tponb [ns] ta [ c] 70 80 90 100 110 120 -40 -20 0 20 40 60 80 100 120 tpoffb [ns] ta [ c] vcc2=10v vcc2=15v vcc2=24v vcc2=10v vcc2=15v vcc2=24v
15 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c t ypical performance curves - continued figure 29. rise time vs output side supply voltage ( 10nf between out - gnd2) figure 30. fall time vs output side supply voltage ( 1 0 n f between out - gnd2 ) 25 50 75 100 10 14 18 22 trise [ns] vcc2 [v] 25 50 75 100 10 14 18 22 tfall [ns] vcc2 [v] ta= - 40 c ta=25 c ta=125 c ta= - 40 c ta=25 c ta=125 c figure 31. mc on r esistance vs temperature figure 32. mc on t hreshold v oltage vs temperature 0.4 0.8 1.2 1.6 2.0 -40 -20 0 20 40 60 80 100 120 ronh [ ] ta [ c] vcc2=10v vcc2=15v vcc2=24v 1.8 1.9 2.0 2.1 2.2 -40 -20 0 20 40 60 80 100 120 vmcon [v] ta [ c] vcc2=10v vcc2=15v vcc2=24v
16 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c t ypical performance curves - continued 8.0 8.5 9.0 9.5 10.0 -40 -20 0 20 40 60 80 100 120 vuvlo2h/l [v] ta [ c] 3.25 3.30 3.35 3.40 3.45 3.50 3.55 3.60 3.65 -40 -20 0 20 40 60 80 100 120 vuvlo1h/l [v] ta [ c] figure 33. i nput side uvlo on/off v oltage vs temperature figure 34. input side uvlo m ask t ime vs temperature vuvlo1h vuvlo1l figure 35. output side uvlo on/off voltage vs temperature figure 36. output side uvlo m ask t ime vs temperature vuvlo2h vuvlo2l 0 1 2 3 4 5 -40 -20 0 20 40 60 80 100 120 tuvlo1msk [s] ta [ c] 0 1 2 3 4 5 -40 -20 0 20 40 60 80 100 120 tuvlo2msk [s] ta [ c]
17 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c t ypical performance curves - continued figure 37. o utput low v oltage vs input side supply voltage (ixflt=5ma) 0.0 0.1 0.2 0.3 0.4 4.50 4.75 5.00 5.25 5.50 vxflt [v] vcc1 [v] ta= - 40 c ta=25 c ta=125 c
18 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c selection of components externally connected figure 38 . for d riving igbt figure 39 . for d riving igbt with b uffer c ircuits figure 4 0 . for d riving igbt with negative p ower s upply gnd1 gen nc gnd1 u nc u nc u xflt u inb u ina u vcc1 nc p uvlo1 1 uvlo1 pulse generator uvlo2 s q r + - nc gen gnd2 nc p vcc 2 out u mc u nc u nc u gnd2 nc u 1pin pre - driver figure 4 1 . for d riving igbt with buffer c ircuits & negative power supply recommended rohm mcr03ezp gnd1 gen nc gnd1 u nc u nc u xflt u inb u ina u vcc1 nc p uvlo1 1 uvlo1 pulse generator uvlo2 s q r + - nc gen gnd2 nc p vcc 2 out u mc u nc u nc u gnd2 nc u 1pin pre - driver recommended rohm mcr03ezp gnd1 gen nc gnd1 u nc u nc u xflt u inb u ina u vcc1 nc p uvlo1 1 uvlo1 pulse generator uvlo2 s q r + - nc gen gnd2 nc p vcc2 out u mc u nc u nc u gnd2 nc u 1pin pre - driver recommended rohm mcr03ezp gnd1 gen nc gnd1 u nc u nc u xflt u inb u ina u vcc1 nc p uvlo1 1 uvlo1 pulse generator uvlo2 s q r + - nc gen gnd2 nc p vcc2 out u mc u nc u nc u gnd2 nc u 1pin pre - driver recommended rohm mcr03ezp recommended rohm mcr100ezp recommended rohm 2sar542p recommended rohm 2scr542p recommended rohm mcr100ezp recommended rohm mcr100ezp recommended rohm mcr03ezp recommended r ohm tdztr5.1 recommended rohm mcr100ezp recommended rohm 2sar542p recommended rohm 2scr542p recommended rohm mcr03ezp recommended rohm tdztr5.1 recommended rohm mcr100ezp recommended rohm mcr100ezp
19 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c figure 42 . for d riving mosfet figure 43 . for d riving mosfet with b uffer c ircuits figure 4 4 . for d riving mosfet with negative p ower s upply gnd1 gen nc gnd1 u nc u nc u xflt u inb u ina u vcc1 nc p uvlo1 1 uvlo1 pulse generator uvlo2 s q r + - nc gen gnd2 nc p vcc 2 out u mc u nc u nc u gnd2 nc u 1pin pre - driver figure 4 5 . for d riving mosfet with buffer c ircuits & negative power supply recommended rohm mcr03ezp gnd1 gen nc gnd1 u nc u nc u xflt u inb u ina u vcc1 nc p uvlo1 1 uvlo1 pulse generator uvlo2 s q r + - nc gen gnd2 nc p vcc 2 out u mc u nc u nc u gnd2 nc u 1pin pre - driver gnd1 gen nc gnd1 u nc u nc u xflt u inb u ina u vcc1 nc p uvlo1 1 uvlo1 pulse generator uvlo2 s q r + - nc gen gnd2 nc p vcc2 out u mc u nc u nc u gnd2 nc u 1pin pre - driver recommended rohm mcr03ezp recommended rohm mcr03ezp gnd1 gen nc gnd1 u nc u nc u xflt u inb u ina u vcc1 nc p uvlo1 1 uvlo1 pulse generator uvlo2 s q r + - nc gen gnd2 nc p vcc2 out u mc u nc u nc u gnd2 nc u 1pin pre - driver recommended rohm mcr03ezp recommended rohm mcr100ezp recommended rohm 2sar542p recommended rohm 2scr542p recommended rohm mcr100ezp recommended rohm mcr100ezp recommended rohm mcr03ezp recommended rohm tdztr5.1 recommended rohm mcr100ezp recommended rohm 2sar542p recommended rohm 2scr542p recommended rohm mcr03ezp recommended rohm tdztr5.1 recommended rohm mcr100ezp recommended rohm mcr100ezp
20 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c power dissipation thermal design please make sure that the ic s chip temperature tj is not over 150 c, while considering the ic s power consumption (w), package power (pd) and ambient temperature (ta). when tj=150 c is exceeded , the function as a semiconductor will not oper ate and some problems (ex. abnormal operation of various parasitic elements and increasing of leak current) occur. constant use under these circumstances leads to deterioration and eventually ic may destruct. tjmax=150 c must be strictly followed under all circumstances. figure 46. ssop - b20w derating curve 0 25 50 75 100 125 150 0 0.5 1.0 1.5 1.19 w 0 25 50 75 100 125 150 0 0.5 1.0 1.5 ambient te mperature: ta[ c ] power dissipation:p d [w] measurement machine kuwano electric measurement condition rohm board board size 3 1 - layer board ja =105.3 c /w
21 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c i/o e quivalen t c ircuit s pin no name i/o equivalence circuit s function 1 out output pin 2 mc output pin for miller clamp 3 in a control input pin a inb control input pin b 4 xflt fault signal output pin ina inb gnd1 vcc1 mc gnd2 vcc2 xflt gnd1 out gnd2 vcc2
22 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply terminals . 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate t he ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of te mperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring p attern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating . 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximatel y obtained . the e lectrical characteristics are guaranteed under the conditions of each parameter . 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance o utput pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to p revent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground , power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and u nintentional solder bridge deposited in between pins during assembly to name a few.
23 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c operational notes C continued 11. unused input terminal s input terminals of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected oper ation of the ic. so unless otherwise specified, unused input terminals should be connected to the power supply or ground line . 12. regard ing i nput p in s of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in orde r to keep them isolated. p - n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction o perates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. fig ure 47 . example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temp erature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). n n p + p n n p + p s u b s t r a t e g n d n p + n n p + n p p s u b s t r a t e g n d g n d p a r a s i t i c e l e m e n t s p i n a p i n a p i n b p i n b b c e p a r a s i t i c e l e m e n t s g n d p a r a s i t i c e l e m e n t s c b e t r a n s i s t o r ( n p n ) r e s i s t o r n r e g i o n c l o s e - b y p a r a s i t i c e l e m e n t s
24 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c ordering informatio n b m 6 0 0 1 4 f v - c e 2 part number package fv : ssop - b20w product class c: for automotive applications packaging and forming specification e2: embossed tape and reel marking diagram s ssop - b20w(top view) b m 6 0 0 1 4 part number marking lot number 1pin mark
25 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c p hysical dimension , tape and reel information package name ssop - b20w
26 / 26 tsz02201 - 0p5p0bh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 25.dec.2015 rev.004 www.rohm.com tsz22111 ? 15 ? 001 b m60014fv - c revision history date revision changes 25.nov.2013 001 new release 2 6.jan.2015 002 page 1 add aec - q100 grade page 15 change typical performance curve figure.36 20 .may.2015 00 3 p age 1 features adding item (ul1577 recognized) 2 5 .dec.2015 00 4 p age 9 adding ul1577 rating table
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. ( n ote1) m edical equipment classifica tion of the specific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a cert ain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the f ollowing are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any specia l or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our products in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cle aning residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proof design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation o f performance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under de viant condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products, please consult with th e rohm representative in advance. for details , please refer to rohm mounting specification
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin con sidering variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contain ed in this document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contain ed in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive pr oduct, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condi tion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connecti ons may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are e xposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaut ion for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all informa tion and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third pa rty regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or impli ed, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert its intellectual property rig hts or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the pr oducts may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated com panies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bm60014fv-c package ssop-b20w unit quantity 2000 minimum package quantity 2000 packing type taping constitution materials list inquiry rohs yes bm60014fv-c - web page distribution inventory

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